Electronics & Additive Manufacturing
...Materially Different
Shaping the future in Electronics & Additive Manufacturing
Since early 2016, ioTech has been developing a unique disruptive multi-material additive manufacturing technology that can process almost any industry certified material at high resolution and high speed.
For the first time, manufacturers can use their standard industrial materials, control the deposition of each single drop and reach unmatched production yields.
In the field of electronics today, ioTech’s technology enables the production of currently unachievable designs and creates an eco-friendly alternative to many traditional manufacturing methods.
Introducing Continuous Laser Assisted Deposition C.L.A.D.
ioTech’s system has been engineered to be simple and robust, with minimum maintenance. Manufacturing using C.L.A.D.’s breakthrough technology consists of three main steps:
- Material micro-coating onto a foil
- Pulse-laser jetting onto the substrate
- Multi-function inline post-processing.
Coating and jetting include micron precision and continuous closed loop monitoring. The integrated in-line post-processing includes UV and thermal curing as well as laser sintering and ablation, enabling fast production of end-use parts in very high quality, in one production step.
ioTech’s breakthrough technologies are protected by an extensive IP portfolio
Offering Exceptional Benefits
All in One Single System
ioTech’s patented C.L.A.D. technology is the world’s first additive manufacturing solution
for standard industrial materials, enabling full scale digital production.
Polymers | Adhesives Metal pastes | Ceramic pastes
Full Freedom of Design
High quality
Less toxicity & less waste
materials
Materials & Electronic Applications
Materials
- Acrylate & Methacrylate
- Epoxy
- Silicone
- Metal paste
- Solder paste
- Solder resist
- Polyurethane
- Ceramic paste
- Carbon paste
- Polyimides
- …
Electronic Applications
- SMT assembly
- HDI PCBs manufacturing
- Conformal coating
- Adhesives dispensing
- Interconnect & via filling
- Advanced packaging
- Multi-layer wire bonding
- Gaskets and sealing
Learn more about :
Management team
Hervé Javice
Co-founder & CEO
Atlas Capital, investment committee & board member; Credit Suisse Financial Products, founder new equity derivative business;
ESCP; MBA Harvard University
Michael Zenou
Co-founder & CTO
Expert in laser assisted deposition; Orbotech, designed first-in-kind copper printer; Israel Nuclear Research Center, researcher Engineer, JCT;
PhD Physics, Hebrew University
Ilana Lurie
CFO & COO
20 years in international finance and operations in large regulated technology companies and startups. Former CFO of NovelSat. Director of Eltek (ELTK)
BA and MBA from Hebrew University
Elad Dotan
VP R&D
Over 10-year experience leading multidisciplinary R&D teams, in semiconductors at Nova Measurement and printing at HP Indigo.
MSc. in physics from Ben-Gurion University