Electronics & Additive Manufacturing
Shaping the future in Electronics & Additive Manufacturing
Since early 2016, ioTech has been developing a unique disruptive multi-material additive manufacturing technology that can process almost any industry certified material at high resolution and high speed.
For the first time, manufacturers can use their standard industrial materials, control the deposition of each single drop and reach unmatched production yields.
In the field of electronics today, ioTech’s technology enables the production of currently unachievable designs and creates an eco-friendly alternative to many traditional manufacturing methods.
Introducing Continuous Laser Assisted Deposition C.L.A.D.
ioTech’s system has been engineered to be simple and robust, with minimum maintenance. Manufacturing using C.L.A.D.’s breakthrough technology consists of three main steps:
- Material micro-coating onto a foil
- Pulse-laser jetting onto the substrate
- Multi-function inline post-processing.
Coating and jetting include micron precision and continuous closed loop monitoring. The integrated in-line post-processing includes UV and thermal curing as well as laser sintering and ablation, enabling fast production of end-use parts in very high quality, in one production step.
ioTech’s breakthrough technologies are protected by an extensive IP portfolio
Offering Exceptional Benefits
All in One Single System
ioTech’s patented C.L.A.D. technology is the world’s first additive manufacturing solution
for standard industrial materials, enabling full scale digital production.
Polymers | Adhesives Metal pastes | Ceramic pastes
Full Freedom of Design
Less toxicity & less waste
Materials & Electronic Applications
- Acrylate & Methacrylate
- Metal paste
- Solder paste
- Solder resist
- Ceramic paste
- Carbon paste
- SMT assembly
- HDI PCBs manufacturing
- Conformal coating
- Adhesives dispensing
- Interconnect & via filling
- Advanced packaging
- Multi-layer wire bonding
- Gaskets and sealing
Learn more about :
Co-founder & CEO
Atlas Capital, investment committee & board member; Credit Suisse Financial Products, founder new equity derivative business; ESCP; MBA Harvard University
Co-founder & CTO
Expert in laser assisted deposition; Orbotech, designed first-in-kind copper printer; Israel Nuclear Research Center, researcher Engineer, JCT; PhD Physics, Hebrew University
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